V. M. Karaban, M. P. Sukhorukov, E. A. Morozov, “Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes”, Computer Research and Modeling, 2014, Volume 6, Issue 3,Pages <nobr>397

MODELS IN PHYSICS AND TECHNOLOGY

Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes

V. M. Karaban^a, M. P. Sukhorukov^a, E. A. Morozov^b

^a Tomsk state university of control systems and radioelectronics, 40 Lenin avenue, Tomsk, Russia, 634050
^b The Joint-stock Company Academician M. F. Reshetnev «Information Satellite Systems», 52 Lenin St., Zheleznogorsk, Krasnoyarsk region, 662972, Russia

Abstract: In this paper we consider software implementation of three-dimensional modeling of thermal processes in multilayer integrated circuits based on low-temperature co-veneering ceramic. The results obtained by the software implemented by the example of the radio frequency receiver module based on low-temperature ceramics for autonomous navigation systems. And also provides a comparison with the results of certified software product.

Keywords: multilayer integrated circuits, low-temperature co-fired ceramic, thermal conditions, space equipment, mathematical modeling, and differential equations.

UDC: 519.688

Received: 23.04.2014
Revised: 22.05.2014

DOI: 10.20537/2076-7633-2014-6-3-397-403