Abstract:
Results from measurements of the electrical resistivity of copper and aluminum conductors under the action of a plane shock wave, and also analysis of the relationship between the electrical resistivity and the hydrostatic pressure and of the theoretical temperature dependence of the electrical resistivity, has made it possible to elucidate the role of defect formation due to the plastic deformation of the metal and to determine its contribution to the increase in electrical resisitivity of the metal. It has been established that the concentration of defects depends on the pressure gradient in a plane shock wave.