Thin aluminum films deposited on liquid nitrogen cooled substrates

The microstructure of aluminum films thermally deposited on monocrystalline silicon substrates at liquid nitrogen temperature and at room temperature has been studied. The results of the study of the morphology and microstructure of the film by X-ray diffraction, atomic force and electron microscopy are presented. It is shown that the RMS roughness decreases from 0.4–1.2 to 0.19–0.34 nm when the substrate is cooled from room temperature to liquid nitrogen temperature.