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Zhurnal Tekhnicheskoi Fiziki, 2008 Volume 78, Issue 12, Pages 70–73 (Mi jtf10280)

This article is cited in 3 papers

Solid-State Electronics

Growth of single-crystalline GaN layers in a horizontal reactor by chloride epitaxy

S. A. Smirnova, V. N. Panteleevb, Yu. V. Zhilyaevb, S. N. Rodinb, A. S. Segalc, Yu. N. Makarovd, A. V. Butashine

a OOO Gallii-N, St. Petersburg, 194156, Russia
b Ioffe Institute, St. Petersburg
c Soft-Impact Ltd., Saint-Petersburg
d Nitride Crystals Group, St.-Petersburg
e Institute of Cristallography Russian Academy of Sciences, Moscow

Abstract: Chloride epitaxy of GaN layers in a horizontal reactor is studied numerically. The steady 3D fluxes of the gas mixture in the reactor are simulated with allowance for heterogeneous reactions on the substrate (growth of epitaxial GaN layers) and on the reactor walls (growth of a polycrystalline GaN deposit). Experimental data on the growth rate distribution for polycrystalline and epitaxial GaN layers are explained. It is shown that, if the diameter of the reactor is not large enough, the growth of the deposit on the walls makes the GaN growth rate distribution over the substrate more nonuniform due to the parasitic diffusion of reagents from the gas phase to the reactor walls.

Received: 22.11.2007


 English version:
Technical Physics, 2008, 53:12, 1602–1605

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