On additional aging-induced hardening of textured ribbon substrates prepared from binary copper-based alloys

The structure and microhardness of textured ribbon substrates made of binary copper-based alloys and annealed in the temperature interval 400–600$^\circ$C is investigated. The optimal temperature of additional annealing at which the strength of Cu–Fe and Cu–Cr alloys reaches a maximum is determined. From experimental data, recommendations on the optimal deposition temperature of epitaxial buffer layers and superconducting films can be developed.