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Zhurnal Tekhnicheskoi Fiziki, 2025 Volume 95, Issue 3, Pages 606–614 (Mi jtf7531)

Special issue on the materials of the International Conference "Nanocarbon and Diamond" (NiA'2024)
Physical electronics

Thermochemical polishing of single-crystal HPHT diamond substrates: surface analysis

K. A. Irzhevskyab, I. V. Klepikovabc, A. V. Koliadind, Yu. V. Patreninc, M. A. Zhiltsove, V. A. Shepelevb, A. A. Altukhovb

a Saint Petersburg State University, St. Petersburg, Russia
b MIREA — Russian Technological University, Moscow, Russia
c Almaz Scientific and Production Complex, Saint Petersburg, Russia
d LLC "NPK Almaz-Karabanovo", Karabanovo, Russia
e LLC "KRISTALIN", Barnaul

Abstract: This work examines the results of processing single-crystal HPHT diamond substrates using the method of thermochemical polishing (TCP). The primary application of this method is to refine the surface of mechanically polished diamond substrates to a state close to atomically smooth. For the first time, optical profilometry was used to obtain results for the entire surface area (4 $\times$ 4 mm) of high-quality diamond substrates. It is shown that thermochemical polishing can significantly improve the morphological characteristics of diamond substrates, with 80–90% of the surface having height variations of less than 200 nm. Data obtained using atomic force microscopy indicate that surface roughness can be reduced to a level of $Ra$ (0.5–0.7) nm. During polishing, depressions of various sizes and depths are also formed, distributed unevenly; as the surface homogeneity increases, the number of these depressions may increase. The study results demonstrate the significant potential of thermochemical polishing of diamond substrates for their industrial use in high-tech fields of microelectronics and micromechanics, which require flat surfaces with minimal roughness.

Keywords: HPHT diamond, thermochemical polishing, mechanical polishing, surface roughness, flatness.

Received: 21.10.2024
Revised: 21.10.2024
Accepted: 21.10.2024

DOI: 10.61011/JTF.2025.03.59868.284-24



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© Steklov Math. Inst. of RAS, 2025