Abstract:
Formation of gold contact pads on dielectric substrates by laser ablation is studied. The mechanical and conductive properties of such contact pads provide a reliable electrical contact between superconducting YBa$_2$Cu$_3$O$_{7-x}$ (YBCO) films (and YBCO-based structures) and add-on electronic components. The contact pads are formed on the substrate before superconducting film deposition. A high adhesion of the contact pad is provided owing to the deep penetration of laser plasma particles into the substrate.