B. Ch. Kholkhoev, Z. A. Matveev, A. N. Nikishina, V. F. Burdukovskii, “Polybenzimidazole-based thiol-ene photosensitive composition for DLP 3D printing”, Mendeleev Commun., 2022, Volume 32, Issue 6,Pages <nobr>813

This article is cited in 6 papers

Communications

Polybenzimidazole-based thiol-ene photosensitive composition for DLP 3D printing

B. Ch. Kholkhoev^a, Z. A. Matveev^a, A. N. Nikishina^b, V. F. Burdukovskii^a

^a Baikal Institute of Nature Management, Siberian Branch of the Russian Academy of Sciences, Ulan-Ude, Russian Federation
^b D. Banzarov Buryat State University, Ulan-Ude, Russian Federation

Abstract: Aphotosensitive composition based on N-allylated poly[2,2'-(p-oxydiphenylene)-5,5'-dibenzimidazole] and pentaerythritol tetrakis(3-mercaptopropionate) has been developed. This photosensitive composition is capable of forming cross-linked 3D-structures due to UV-initiated thiol-ene polymerization. Using digital light processing 3D printing, 3D-objects with high resolution, mechanical strength and thermal resistance up to 397 °C are formed.

Keywords: polybenzimidazoles, thiol-ene polymerization, digital light processing, 3D printing, photopolymerization.

Language: English

DOI: 10.1016/j.mencom.2022.11.035

	*Supplementary materials:*
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