RUS  ENG
Full version
JOURNALS // Problemy Fiziki, Matematiki i Tekhniki (Problems of Physics, Mathematics and Technics) // Archive

PFMT, 2014 Issue 3(20), Pages 26–31 (Mi pfmt317)

This article is cited in 2 papers

PHYSICS

Aqueous compositions based on nanosized silica particles for chemical-mechanical polishing of silicon wafers

Ya. A. Kosenoka, V. E. Gaishuna, O. I. Tyulenkovaa, V. G. Denismanb

a F. Scorina Gomel State University, Gomel, Belarus
b «Kamerton» subsidiary of JSC «INTEGRAL», Pinsk, Belarus

Abstract: The method of preparation of suspensions based on nano-sized particles of fumed silica is described. The process and results of chemical-mechanical polishing of silicon wafers carried out in industrial environments are investigated. Recommendations on the use of polishing compositions in the chemical-mechanical polishing are making. When using the polishing suspensions SPS-81M and SPS-55M in the process of single-crystal silicon wafer CMP, high structural perfection and atomic smoothness of the surface roughness are achieved at the level of tenths of a nanometer.

Keywords: chemical-mechanical polishing, fumed silica, nanosized particles, surface, roughness.

UDC: 546.28

Received: 25.07.2014



© Steklov Math. Inst. of RAS, 2024