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JOURNALS // Fizika i Tekhnika Poluprovodnikov // Archive

Fizika i Tekhnika Poluprovodnikov, 2020 Volume 54, Issue 8, Pages 771–777 (Mi phts5194)

This article is cited in 2 papers

Manufacturing, processing, testing of materials and structures

Calculating silicon-amorphization doses under medium-energy light-ion irradiation

E. V. Okulicha, V. I. Okulichb, D. I. Tetelbauma

a State University of Nizhny Novgorod
b Nizhny Novgorod Institute of Management, Branch of the Russian Presidential Academy of National Economy and Public Administration, Nizhny Novgorod, Russia

Abstract: Based on the previously proposed diffusion-coagulation model of defect formation under the ion irradiation of silicon using the numerical solution of the corresponding kinetic equations, amorphization doses $\Phi_{\mathrm{am}}$ for medium-energy ions with a mass of $M_1\le$ 31 amu are calculated. It is assumed that amorphization at a specified depth occurs at a dose corresponding to a certain threshold total concentration $C_{\mathrm{am}}$ of vacancies and divacancies. In the calculation, the variable parameters are the ion energy, ion-current density, temperature, threshold atomic-displacement energy $E_d$, and $C_{\mathrm{am}}$. The limits of applicability of the diffusion-coagulation model are determined. Comparison of the results of calculation within these limits with published experimental data shows, with regard to a variation in the experimental data and some freedom in choosing the parameters $E_d$ and $C_{\mathrm{am}}$, satisfactory agreement between the calculated and experimental $\Phi_{\mathrm{am}}$ values.

Keywords: silicon, ion irradiation with light ions, diffusion-coagulation model of defect formation, calculation of amorphization doses.

Received: 19.12.2019
Revised: 14.01.2020
Accepted: 14.01.2020

DOI: 10.21883/FTP.2020.08.49649.9338


 English version:
Semiconductors, 2020, 54:8, 916–922

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© Steklov Math. Inst. of RAS, 2024