The thermoelectric power of Bi$_{1-x}$Sb$_{x}$ (0 $\le x\le$ 0.15) on mica and polyimide substrates in the temperature range of 77–300 K

This report presents the results of the study of thermoelectricpower of the thin block films of Bi$_{1-x}$Sb$_{x}$ (0 $\le x\le$ 0.15) with the thickness of 100–1000 nm on the mica and polyimide substrates in the temperature range 77–300 K. The applied technique for measuring thermoelectric power allows to prevent the additional film deformation due to the difference in the thermal expansion of the sample in question and measurement cell. The structure, temperature dependences of the thermopower and the resistivity of thin films were analyzed, and the power factor was estimated. A difference was found in the nature of the temperature dependences of the thermopower and the specific resistance of films on mica and polyimide substrates. This difference is explained by the change of the band structure parameters under the influence of film deformation due to the difference in the thermal expansion of the film and substrate.