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Fizika i Tekhnika Poluprovodnikov, 2019 Volume 53, Issue 3, Pages 423–429 (Mi phts5576)

This article is cited in 24 papers

Manufacturing, processing, testing of materials and structures

Crystallization of amorphous germanium films and multilayer $a$-Ge/$a$-Si structures upon exposure to nanosecond laser radiation

V. A. Volodinab, G. K. Krivyakinba, G. D. Ivlevc, S. L. Prokopyevc, S. V. Gusakovac, A. A. Popovd

a Rzhanov Institute of Semiconductor Physics, Siberian Branch of Russian Academy of Sciences, Novosibirsk
b Novosibirsk State University
c Belarusian State University, Minsk
d Yaroslavl branch of the Institute of physics and technology, Institution of Russian academy of sciences

Abstract: The processes of the crystallization of amorphous germanium films and multilayer germanium/silicon structures upon exposure to nanosecond (70 ns) ruby laser radiation ($\lambda$ = 694 nm) are studied. The samples are grown on silicon and glassy substrates by plasma-enhanced chemical vapor deposition. Pulsed laser annealing of the samples is conducted in the range of pulse energy densities $E_ p$ from 0.07 to 0.8 J cm$^{-2}$. The structure of the films after annealing is determined by analyzing the scanning electron microscopy data and Raman spectra. It is established that, after annealing, the films are completely crystallized and, in this case, contain regions of coarse crystalline grains ( $>$ 100 nm), whose fraction increases, as $E_ p$ is increased, and reaches 40% of the area. From analysis of the position of the Raman peaks, it is conceived that the crystalline grains, whose dimensions exceed 100 nm, either contain structural defects or stretching strains. The correlation length of optical vibrations is determined from the phonon confinement model and found to increase from 5 to 8 nm, as $E_p$ is increased. Pulsed laser annealing of multilayer Ge(10 nm)/Si(5 nm) structures induces partial intermixing of the layers with the formation of Ge–Si alloys.

Received: 11.10.2018
Revised: 17.10.2018

DOI: 10.21883/FTP.2019.03.47298.8997


 English version:
Semiconductors, 2019, 53:3, 400–405

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