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JOURNALS // Fizika i Tekhnika Poluprovodnikov // Archive

Fizika i Tekhnika Poluprovodnikov, 2017 Volume 51, Issue 12, Pages 1656–1662 (Mi phts5970)

This article is cited in 1 paper

Surface, interfaces, thin films

Effect of Ag in CdSe thin films prepared using thermal evaporation

T. C. Santhosha, K. V. Bangeraa, G. K. Shivakumarb

a Thin Film Laboratory, Department of Physics, National Institute of Technology, Karnataka, Surathkal, Mangalore, India
b Department of physics, NMAM Institute of Technology, Nitte, India

Abstract: It has been a general practice to dope thin films with suitable dopants to modify the properties of the films to make them more suitable for potential applications. When the dopant concentrations are low, they do not normally affect the structure and morphology of the films. However, it may lead to drastic changes in electronic properties of the films. This might result from the dopant getting incorporated into the lattice of the material of the films. Cadmium selenide is an important compound semiconductor material with an attractive energy band gap. The present work relates to an attempt made to dope CdSe thin films with silver. CdSe : Ag (1 to 5%) thin films were deposited on glass substrates at an optimized substrate temperature of 453 K using thermal evaporation technique. The grown films were analyzed using X-ray diffraction, scanning electron microscopy (SEM), energy dispersive analysis of X-ray (EDX) techniques. It is observed that undoped CdSe thin films and CdSe : Ag films have hexagonal structure. The grain size was found to increase marginally with an increase in the Ag concentration. The optical band gap of the films determined by optical transmission measurements agree with that of CdSe. Electrical conductivity is observed to increase from 10$^{-4}$ to 3.66 ($\Omega$ $\cdot$ cm)$^{-1}$ on addition of silver. The variation of resistance with temperature indicates that the prepared films consist of CdSe and Ag existing as two separate phases coexisting and contributing individually to the resistivity of the films.

Received: 12.10.2016
Revised: 12.03.2017

Language: English

DOI: 10.21883/FTP.2017.12.45181.8430


 English version:
Semiconductors, 2017, 51:12, 1597–1603

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