Influence of heat treatment of the thermoelectrical and mechanical properties of $p$-type Bi$_{0.5}$Sb$_{1.5}$Te$_3$ solid solution obtained by extrusion method

The work carried out a study of the effect of heat treatment on the mechanical strength and thermoelectric figure of merit of the Bi$_{0.5}$Sb$_{1.5}$Te$_3$ solid solution. A decrease in the ultimate strength and the appearance of yield after annealing associated with antistructural defects were revealed. It has been established that heat treatment reduces the conductivity and thermal conductivity of the thermoelectric material, and also increases the Seebeck coefficient, which leads to an increase in thermoelectric efficiency from Bi$_{0.5}$Sb$_{1.5}$Te$_3$ to 3.5 $\cdot$ 10$^{-3}$K$^{-1}$.