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Fizika i Tekhnika Poluprovodnikov, 2023 Volume 57, Issue 3, Pages 195–201 (Mi phts6855)

Semiconductor structures, low-dimensional systems, quantum phenomena

Radiation hardness of bipolar transistor based integrated circuits improved by ECR hydrogen plasma treatment and Si-wafers gettering

E. A. Polushkinab, S. V. Nefed'evb, O. A. Soltanovicha, A. V. Kovalchuka, S. Yu. Shapovala

a Institute of Microelectronics Technology and High-Purity Materials RAS, 142432 Chernogolovka, Russia
b Molecular Electronics Research Institute, 124460 Moscow, Russia

Abstract: We demonstrate significant improvement of the radiation immunity of the integrated circuits based on silicon bipolar transistors. Strong decrease of the current gain degradation and significant yield improvement after high-energy $\gamma$ irradiation are both shown. This was achieved by development of efficient hydrogenation process for the silicon bulk and the surface dielectric layer using electron cyclotron resonance (ECR) plasma, as well as implementation of effective Si-wafer gettering option.

Keywords: integrated circuits, bipolar transistors, ECR-plasma, hydrogenation of semiconductor structures, trap state passivation, gettering of semiconductor wafers, $\gamma$-irradiation, radiation hardness, yield of workable transistors.

Received: 19.12.2022
Revised: 04.04.2023
Accepted: 05.04.2023

DOI: 10.21883/FTP.2023.03.55633.4467



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