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Fizika i Tekhnika Poluprovodnikov, 2022 Volume 56, Issue 4, Pages 420–425 (Mi phts7032)

Micro- and nanocrystalline, porous, composite semiconductors

Current transfer in a semiconductor structure with a porous silicon film formed by metal-stimulated etching

N. N. Mel'nika, V. V. Tregulovb, V. G. Litvinovc, A. V. Ermachikhinc, E. P. Trusovc, G. N. Skoptsovab, A. I. Ivanovb

a P. N. Lebedev Physical Institute, Russian Academy of Sciences, 119991 Moscow, Russia
b Ryazan State University S. A. Esenin, 390000 Ryazan, Russia
c Ryazan State Radio Engineering University, 390005 Ryazan, Russia

Abstract: It is shown that during a porous Si film formation by metal-stimulated etching a barrier layer is formed on a monocrystal $p$-Si substrate. The rectifying properties of the semiconductor structure can be explained by the fixation of the Fermi level in the near-surface layer of porous Si due to a high concentration of electrically active defects (deep centers or traps). It causes to energy bands bending and the appearance of a potential barrier. The study of Raman scattering showed the absence of size effects and a change in the band gap in the porous Si film. Activation energies of deep centers by the temperature dependence of the current-voltage characteristics and deep level transient spectroscopy study were determined.

Keywords: porous silicon, deep level, Raman scattering, current-voltage characteristics, deep level transient spectroscopy.

DOI: 10.21883/FTP.2022.04.52197.9782



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