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Fizika i Tekhnika Poluprovodnikov, 2013 Volume 47, Issue 3, Pages 426–431 (Mi phts7866)

This article is cited in 7 papers

Manufacturing, processing, testing of materials and structures

The mechanism of contact-resistance formation on lapped $n$-Si surfaces

A. V. Sachenkoa, A. E. Belyaeva, N. S. Boltovetsb, A. O. Vinogradova, L. M. Kapitanchukc, R. V. Konakovaa, V. P. Kostylyova, Ya. Ya. Kudryka, V. P. Klad'koa, V. N. Sheremeta

a Institute of Semiconductor Physics NAS, Kiev
b State Enterprise Research Institute "Orion", Kyiv, 03057, Ukraine
c E. O. Paton Electric Welding Institute, National Academy of Sciences of Ukraine

Abstract: Anomalous temperature dependences of the specific contact resistance $\rho_c(T)$ of Pd$_2$S–Ti–Au ohmic contacts to lapped $n$-Si with dopant concentrations of 5 $\times$ 10$^{16}$, 3 $\times$ 10$^{17}$, and 8 $\times$ 10$^{17}$ cm$^{-3}$ have been obtained. The anomalous dependences of $\rho_c(T)$ have been accounted for under the assumption that the current flows along nanodimensional metallic shunts, which are combined with dislocations with a diffusionrelated limit in the supply of charge carriers taken into account. The densities of conducting and scattering dislocations in the surface region of the semiconductor are determined.

Received: 16.07.2012
Accepted: 25.07.2012


 English version:
Semiconductors, 2013, 47:3, 449–454

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