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JOURNALS // Fizika i Tekhnika Poluprovodnikov // Archive

Fizika i Tekhnika Poluprovodnikov, 2012 Volume 46, Issue 4, Pages 562–568 (Mi phts8224)

This article is cited in 6 papers

Manufacturing, processing, testing of materials and structures

Effect of post oxidation annealing on electrical characteristics of Ni/SiO$_2$/4H-SiC capacitor with varying oxide thickness

Sanjeev K. Guptaa, A. Azamb, J. Akhtara

a Sensors and Nano-Technology Group, Semiconductor Devices Area Central Electronics Engineering Research Institute (CEERI)/Council of Scientific and Industrial Research (CSIR), Pilani-333 031, India
b Center of Excellence in Materials science (Nanomaterials), Department of Applied Physics, Z.H. College of Engineering and Technology, Aligarh Muslim University, Aligarh-202002, India

Abstract: This paper describes an experimental observation of post oxidation annealing (POA) treatment on current-voltage and capacitance-voltage characteristics of Ni/SiO$_2$/4H-SiC system with varying oxide thickness. The leakage current of fabricated structures shows an asymmetric behavior having noticeable effect of POA with the polarity of gate bias (+V or -V at the anode). When compared with the conventional wet oxidation, the POA processes greatly reduce interface-state density and enhance reliability of devices. An extensive increment in the barrier height at SiO$_2$/4H-SiC interface was observed due to POA, which resulted into lower forward leakage current. A significant improvement in the oxide charges are also demonstrated using CV characteristics of POA treated structures.

Received: 15.02.2011
Accepted: 20.09.2011

Language: English


 English version:
Semiconductors, 2012, 46:4, 545–551

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