Abstract:
A nanorelief forming on a copper surface under oblique irradiation with cluster ions has been examined at different irradiation doses and target temperatures. This nanorelief has been found to evolve into an ordered undulating structure. It has been demonstrated that the initial roughness is smoothed out at higher target temperatures. The mechanisms of formation of the surface topography have been identified, and their efficiency has been determined.
Keywords:cluster ions, sputtering, nanorelief, self-organization, atomic force microscopy.