Modeling deformations in multichip packages of NAND memory

Deformation of NAND memory multichip packages (MCPs) with various thicknesses of substrate and silicon dies have been numerically simulated. The results of calculations are consistent with experimental data and show equivalence of the deformation in single- and multichip packages with the same total thickness of silicon. Analytical relationship between the values of MCP deformation, substrate core thickness, and total thickness of silicon dies is proposed, which agrees quite well with the data of modeling and can be used for preliminary estimation of MCP deformations.