Laser metallization of curved surfaces from deep eutectic solutions

The development of electronics poses challenges that are difficult to solve using traditional methods, including obtaining metal coatings on a curved surface. One of the methods of solving this problem is presented – laser deposition of metallic copper on a curved glass substrate. A glass cylinder with a radius of 5 mm was selected as a demonstration substrate. The minimum width of the deposited track was 52 $\mu$m, the width deviation did not exceed 10% over the entire curved surface.The specific resistance of the track did not exceed 0.6 $\Omega$ $\cdot$ mm$^2$/m, which allows the method to be used to create copper coatings – components of electronic devices. To demonstrate the capabilities of the method, grids with a cell size of 500 $\mu$m were deposited.