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Pisma v Zhurnal Tekhnicheskoi Fiziki, 2023 Volume 49, Issue 15, Pages 3–6 (Mi pjtf7035)

Thin-film LED based on AlInGaN layers grown on hybrid SiC/Si substrates

L. K. Markova, S. A. Kukushkinb, A. S. Pavluchenkoa, I. P. Smirnovaa, A. V. Sakharova, A. E. Nikolaeva, A. S. Grashchenkob, A. V. Osipovb, A. F. Tsatsul'nikovc

a Ioffe Institute, St. Petersburg, Russia
b Institute of Problems of Mechanical Engineering, Russian Academy of Sciences, St. Petersburg, Russia
c Submicron Heterostructures for Microelectronics Research and Engineering Center, Russian Academy of Sciences, St. Petersburg, Russia

Abstract: We present the results of fabrication of flip-chip LEDs with removed substrate from AlInGaN heterostructures grown on SiC/Si substrates synthesized by vacancy-matching atom substitution. It is shown that SiC/Si substrates are optimal from the viewpoint of matching lattice parameters, thermal conductivity, and optical characteristics of the material at a significantly lower cost. Therewith, the procedure of cutting wafers into individual chips and removal of the opaque silicon part of the substrate becomes easier, and the transparent SiC part of the substrate remaining on the chip surface creates a relief that facilitates light output.

Keywords: thin-film LEDs, LEDs on silicon, LEDs on silicon carbide on silicon, AlInGaN heterostructures, SiC/Si.

Received: 04.05.2023
Revised: 18.05.2023
Accepted: 18.05.2023

DOI: 10.21883/PJTF.2023.15.55855.19616



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