Abstract:
The results of the growth of silicon-carbide films on silicon wafers with a large diameter of 150 mm (6") by using a new method of solid-phase epitaxy are presented. A SiC film growing on Si wafers was studied by means of spectral ellipsometry, SEM, X-ray diffraction, and Raman scattering. As follows from the studies, SiC layers are epitaxial over the entire surface of a 150-mm wafer. The wafers have no mechanical stresses, are smooth, and do not have bends. The half-width of the X-ray rocking curve (FWHM$_{\omega-\theta}$) of the wafers varies in the range from 0.7$^\circ$ to 0.8$^\circ$ across the thickness layer of 80–100 nm. The wafers are suitable as templates for the growth of SiC, AlN, GaN, ZnO, and other wide-gap semiconductors on its surface using standard CVD, HVPE, and MBE methods.