RUS  ENG
Full version
JOURNALS // Pisma v Zhurnal Tekhnicheskoi Fiziki // Archive

Pisma v Zhurnal Tekhnicheskoi Fiziki, 2014 Volume 40, Issue 1, Pages 71–79 (Mi pjtf8046)

This article is cited in 8 papers

Epitaxial silicon carbide on a 6" silicon wafer

S. A. Kukushkinab, A. V. Lukyanovab, A. V. Osipovab, N. A. Feoktistovab

a Institute of Problems of Mechanical Engineering, Russian Academy of Sciences, St. Petersburg
b Ioffe Institute, St. Petersburg

Abstract: The results of the growth of silicon-carbide films on silicon wafers with a large diameter of 150 mm (6") by using a new method of solid-phase epitaxy are presented. A SiC film growing on Si wafers was studied by means of spectral ellipsometry, SEM, X-ray diffraction, and Raman scattering. As follows from the studies, SiC layers are epitaxial over the entire surface of a 150-mm wafer. The wafers have no mechanical stresses, are smooth, and do not have bends. The half-width of the X-ray rocking curve (FWHM$_{\omega-\theta}$) of the wafers varies in the range from 0.7$^\circ$ to 0.8$^\circ$ across the thickness layer of 80–100 nm. The wafers are suitable as templates for the growth of SiC, AlN, GaN, ZnO, and other wide-gap semiconductors on its surface using standard CVD, HVPE, and MBE methods.

Received: 19.08.2013


 English version:
Technical Physics Letters, 2014, 40:1, 36–39

Bibliographic databases:


© Steklov Math. Inst. of RAS, 2025