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JOURNALS // Prikladnaya Mekhanika i Tekhnicheskaya Fizika // Archive

Prikl. Mekh. Tekh. Fiz., 2011 Volume 52, Issue 4, Pages 3–20 (Mi pmtf1497)

This article is cited in 3 papers

On the role of heat conduction in the formation of a high-temperature plasma during counter collision of rarefaction waves of solid deuterium

A. A. Charakhch'yana, V. I. Gryn'a, K. V. Khishchenkob

a Dorodnitsyn Computing Center, Russian Academy of Sciences, Moscow, 119333, Russia
b Joint Institute of High Temperatures, Russian Academy of Sciences, Moscow, 125412, Russia

Abstract: This paper considers the problem of counter collision of rarefaction waves of solid deuterium produced by the simultaneous incidence of two identical shock waves on free surfaces located at a certain distance from each other. The motion of deuterium is described by the equations of one-velocity two-temperature hydrodynamics. The model of electron and ion heat transfer takes into account heat-flux relaxation. The parametric properties of the problem are investigated. It is shown that with decreasing distance between the free surfaces, the maximum temperature of the plasma ceases to depend on this parameter. At moderate distances between the free surfaces, the maximum plasma temperature becomes much lower than the temperature obtained earlier in the problem for the equations of nondissipative hydrodynamics. With increasing pressures in the incident shock wave, the maximum ion temperature increases linearly, reaching a value approximately equal to 160 $\cdot$ 10$^6$ K at 500 Mbar. In the case of a shock wave with a pressure of 50 Mbar at a gap of 2 mm between the free surfaces of deuterium, the yield of fusion neutrons increases roughly by a factor of 10 compared to the yield of neutrons in the case of no gap.

Keywords: shock wave, rarefaction wave, high-temperature plasma, solid deuterium, heat conduction, heat-flux relaxation.

UDC: 533.9.03

Received: 18.12.2009
Accepted: 25.06.2010


 English version:
Journal of Applied Mechanics and Technical Physics, 2011, 52:4, 501–516

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