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JOURNALS // Uspekhi Khimii // Archive

Usp. Khim., 1983 Volume 52, Issue 8, Pages 1365–1409 (Mi rcr3490)

This article is cited in 5 papers

The Technology, Structure, and Properties of Organosilicon Dielectrics-polyorganosilasesquioxanes

A. M. Ton'shina, B. A. Kamaritskiib, V. N. Spektorb

a Moscow State (V. I. Lenin) Pedagogical Institute
b Institute of Chemical Physics of the USSR Academy of Sciences, Moscow

Abstract: The available information about the technology of the preparation of polyorganosilasesquioxanes, their structure, and properties is described systematically, surveyed, and compared with that on inorganic oxide dielectrics. The possibilities and advantages of their application as dielectric materials in semiconductor electronics are examined; analysis of the experimental literature data has led to the conclusion that the method of preparation has a decisive influence on the mechanism of the formation of oligomer molecules their conversion into polymers, and their interaction with various supports.
The bibliography includes 281 references.

UDC: 546.267:547.121

DOI: 10.1070/RC1983v052n08ABEH002883


 English version:
Russian Chemical Reviews, 1983, 52:8, 775–803

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