Impact of liquid drop over a superhydrophobic surface

The impact of a liquid drop over a copper surface is investigated. The substrate is assumed to be superhydrophobic with a equilibrium contact angle of 150$^\circ$. Based on the volume of the drop, the Bond and Weber numbers are 0.23 and 1.6, respectively. Surface temperature and ambient air is at 298 K, and the temperature of the liquid drop is 5 K lower than the ambient. Simulation of conjugate heat transfer is performed using the axi-symmetric coordinate system. The Kistler contact line model is used to predict the dynamic contact angle of the drop during spreading. In the present work, we investigate the temporal variation of the shear stress and the wall heat flux induced over a substrate during the drop spreading.