Thermal expansion and electrical resistivity of the intermetallic compound $\rm Ti_{67}\rm Al_{33}$

The thermal expansion coefficient and electrical resistivity are measured simultaneously on the same polycrystalline sample of $\rm Ti_{67}\rm Al_{33}$ in the temperature range of $300$–$1000$ K. The two measured parameters exhibit a qualitative correlation for both the stable and metastable states of the sample. The temperature dependence of the electrical resistivity is shaped by the competition between the semiconductor and metal conductivity mechanisms.