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JOURNALS
// Teplofizika vysokikh temperatur
// Archive
TVT,
1995
Volume 33,
Issue 2,
Pages
325–327
(Mi tvt2918)
Short Communications
Investigation of the melting temperature of lead and POS-1 solder in porous copper- and nickel-based compounds
V. A. Sozaev
,
Kh. B. Khokonov
,
Kh. T. Shidov
Kabardino-Balkar State University, Nal'chik
UDC:
536.421.1+541.182.3:546.68
Received:
11.05.1994
Fulltext:
PDF file (1010 kB)
English version:
High Temperature, 1995,
33
:2,
323–325
Bibliographic databases:
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Steklov Math. Inst. of RAS
, 2024