Modeling of the stress-strain state in a plate of a composite material (WC-Co) at diamond grinding

The aim of this paper is to model the deformation occurring in a plate of a composite material (WC-Co) during the grinding process. It is shown that, with an increase in the grinding rate, damages can appear in the volume of a plate of the BK6 hard alloy at a depth of more than 1 mm under the processed surface. The results of the numerical simulation correlate with the experimental data obtained earlier for combined electrodiamond processing.