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ЖУРНАЛЫ // Физика и техника полупроводников // Архив

Физика и техника полупроводников, 2021, том 55, выпуск 1, страница 83 (Mi phts6587)

Эта публикация цитируется в 4 статьях

Физика полупроводниковых приборов

Silicon nanowire parameter extraction using DFT and comparative performance analysis of SiNWFET and CNTFET devices

B. Singha, B. Prasada, D. Kumarb

a Department of Electronic Science, Kurukshetra University-136119, India
b J.C. Bose University of Science and Technology, Faridabad-121006, India

Аннотация: The performance and scalability of silicon nanowire field-effect transistor (SiNWFET) and carbon nanotube field-effect transistor (CNTFET) with surround gate geometry are studied using such tools as material exploration and design analysis (MedeA) and device modeling and simulation SilvacoTCAD. The SiNWFET and CNTFET with gate-all-around (GAA) structure offer good gate electrostatic control, high On-current, and better suppression of short-channel effects with complete encirclement of the device channel. Rather than using the bulk properties of silicon, estimation of properties SiNW was made using MedeA VASP tool based on density functional theory (DFT). In this study, the device input ($I_\mathrm{D}$-$V_\mathrm{GS}$) and output ($I_\mathrm{D}$-$V_\mathrm{DS}$) have been analyzed and parameters like threshold voltage, $I_\mathrm{On}/I_\mathrm{Off}$ ratio, drain induced barrier lowering, and sub-threshold slope extracted, and comparison is made between SiNWFET and CNTFET devices. The results point towards the DFT-based material parameter estimation to incorporate the quantum effects and usage of SiNW/CNT-based GAA structure utility below 10 nm to meet scaling targets. The results suggest that the SiNWFET and CNTFET device with GAA geometry could be better alternative to conventional MOSFETs and FinFET for numerous high-performance and low-power device applications.

Ключевые слова: SiNWFET, CNTFET, FINFET, DFT, VASP, TCAD.

Поступила в редакцию: 06.04.2020
Исправленный вариант: 01.08.2020
Принята в печать: 13.08.2020

Язык публикации: английский


 Англоязычная версия: Semiconductors, 2021, 55:1, 100–107


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