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ЖУРНАЛЫ // Физика и техника полупроводников // Архив

Физика и техника полупроводников, 2012, том 46, выпуск 4, страницы 473–481 (Mi phts8209)

Эта публикация цитируется в 33 статьях

Электронные свойства полупроводников

Similarities and distinctions of defect production by fast electron and proton irradiation: moderately doped silicon and silicon carbide of $n$-type

V. V. Emtseva, A. M. Ivanova, V. V. Kozlovskib, A. A. Lebedeva, G. A. Oganesyana, N. B. Strokana, G. Wagnerc

a Ioffe Physicotechnical Institute, Russian Academy of Sciences, 194021 St. Petersburg, Russia
b St. Petersburg State Polytechnic University, 195251 St. Petersburg, Russia
c Leibniz-Institute for Crystal Growth, D-12489, Berlin, Germany

Аннотация: Effects of irradiation with 0.9 MeV electrons as well as 8 and 15 MeV protons on moderately doped $n$-Si grown by the floating zone (FZ) technique and $n$-SiC (4H) grown by chemical vapor deposition are studied in a comparative way. It has been established that the dominant radiation-produced defects with involvement of V group impurities differ dramatically in electron- and proton-irradiated $n$-Si (FZ), in spite of the opinion on their similarity widespread in literature. This dissimilarity in defect structures is attributed to a marked difference in distributions of primary radiation defects for the both kinds of irradiation. In contrast, DLTS spectra taken on electron- and proton-irradiated $n$-SiC (4H) appear to be similar. However, there are very much pronounced differences in the formation rates of radiation-produced defects. Despite a larger production rate of Frenkel pairs in SiC as compared to that in Si, the removal rates of charge carriers in $n$-SiC (4H) were found to be considerably smaller than those in $n$-Si (FZ) for the both electron and proton irradiation. Comparison between defect production rates in the both materials under electron and proton irradiation is drawn.

Поступила в редакцию: 22.10.2011
Принята в печать: 24.11.2011

Язык публикации: английский


 Англоязычная версия: Semiconductors, 2012, 46:4, 456–465

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